NcodiN Secures €16M Seed Round to Break AI’s Main Bottleneck with the World’s Smallest Laser

NcodiN Secures €16M Seed Round to Break AI’s Main Bottleneck with the World’s Smallest Laser


Co-founders of NcodiN: Fabrice Raineri (CSO), Bruno Garbin (CTO), and Francesco Manegatti (CEO).
Co-founders of NcodiN: Fabrice Raineri (CSO), Bruno Garbin (CTO), and Francesco Manegatti (CEO).

PARIS, November 20, 2025–(BUSINESS WIRE)–NcodiN, the deep-tech startup pioneering optical interposer technology with integrated nanolasers, has secured €16 million in oversubscribed Seed financing round.

The funding will propel NcodiN from R&D to industrial scale, enabling to develop product development, key engineering hires to support the industrialization of its technology in a CMOS pilot line on 300 mm wafers, and the build-out of its supply chain and customer partnerships.

The equity round was led by MIG Capital, with participation from Maverick Silicon, PhotonVentures, and Verve Ventures, alongside continued support from existing backers Elaia, Earlybird, and OVNI.

Transforming the Future of AI Hardware

NcodiN is developing NConnect, a new generation of photonic interposers designed to overcome the “copper wall”—the performance and energy limits of electrical interconnects that constrain AI systems. At its core is the world’s smallest laser, enabling dense integration on silicon and unprecedented scalability without disrupting existing processor architectures.

This breakthrough allows chipmakers to pack supercomputer-level power into a single processor, paving the way for faster, more efficient AI hardware. This fundraising will accelerate industrialization of the platform, including an industrial pilot to demonstrate compatibility with advanced packaging techniques.

With this round, NcodiN will also establish a Silicon Valley presence, expand its R&D capacity, and scale its team in preparation for large-scale manufacturing partnerships – bringing new technology to break the copper wall and redefine AI hardware performance.

“This funding marks a pivotal milestone for NcodiN. We are delivering the missing piece for the industry’s most pressing challenge: enabling extremely high memory bandwidth to power the AI factories of tomorrow. Our technology unlocks wafer-scale superchips by providing the most energy-efficient interconnects for networking across tens of chiplets – an essential component in the architectures everyone is chasing. As new generations of GPUs and AI accelerators emerge to keep pace with rapidly evolving GenAI algorithms, NcodiN is laying the photonic foundation that makes them possible.”

Francesco Manegatti, CEO and Co-founder, NcodiN

“Memory bandwidth has become a defining bottleneck in AI, with copper interconnects struggling to deliver the reach and efficiency required for next-generation systems. NcodiN’s photonic interposers unlock memory bandwidth and capacity beyond copper’s limits. We are excited to support NcodiN as they enable architectures that will define the future of AI hardware.”



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